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 CHR2291
12-17GHz Integrated Down Converter
GaAs Monolithic Microwave IC Description
The CHR2291 is a multifunction chip which integrates a LO time two multiplier, a balanced cold FET mixer, and a RF LNA. It is designed for a wide range of applications, typically commercial communication systems. The backside of the chip is both RF and DC grounds. This helps simplify the assembly process. The circuit is manufactured with a PM-HEMT process, 0.25m gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is available in chip form.
LO
Q GM GB VDM VDL GX VGA RF
I
Main Features * * * * * * *
14
Typical on wafer measurement: Conversion Gain & Image suppression @ IF=1& 1.5GHz
12 10 8 6 4 2 0 -2 -4 -6 -8 -10 -12 -14 -16 11,0 12,0 13,0 14,0 15,0 16,0 17,0 18,0
Broadband performances : 12-17GHz 10 dB conversion gain 3.5dB noise figure -8dBm RF input power (1dB gain comp.) Low DC power consumption, 130mA@3.5V Chip size : 2.49 X 2.13 X 0.10 mm
(dB)
2LO Frequency
10dBm LO input power
RF Frequency (GHz)
Main Characteristics
Tamb. = 25C Parameter Min Typ Max Unit
FRF FLO FIF Gc
RF frequency range LO frequency range IF frequency range Conversion gain
12 5.25 0.25 +10
17 7.75 1.5
GHz GHz GHz dB
ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !
Ref. : DSCHR22912218 06-Aug.-02 1/6 Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
12-17GHz Integrated Down Converter
Electrical Characteristics for Broadband Operation
Tamb = +25C, Vd = 3.5V ,Idl=50mA, Idm=50mA Symbol
FRF FLO FIF Gc NF PLO Img Sup P1dB
CHR2291
Parameter
RF frequency range LO frequency range IF frequency range Conversion gain (1) Noise Figure (1) LO Input power Image Suppression Input power at 1dB gain compression
Min
12 5.25 0.25
Typ
Max
17 7.75 1.5
Unit
GHz GHz GHz dB dB dBm dBc dBm
+10 3.5 +10 15 -8 2.0:1 2.0:1 100
LO VSWR Input LO VSWR (1) RF VSWR Input RF VSWR (1) Id Bias current (2)
mA
(1) On Wafer measurements (2) Current source biasing network is recommended. Optimum performances for Idm= 50mA and Idl= 50mA
Absolute Maximum Ratings
Tamb. = 25C (1) Symbol
Vd Id Vg Vdg Pin Tch Ta Tstg
Parameter
Maximum drain bias voltage Maximum drain bias current Gate bias voltage Maximum drain to gate voltage ( Vd- Vg) Maximum peak input power overdrive (2) Maximum channel temperature Operating temperature range Storage temperature range
Values
4.0 180 -2.0 to +0.4 +5 +15 175 -40 to +85 -55 to +125
Unit
V mA V V dBm C C C
(1) Operation of this device above anyone of these parameters may cause permanent damage. (2) Duration < 1s.
Ref. : DSCHR22912218 06-Aug.-02 2/6 Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
12-17GHz Integrated Down Converter
Typical On-wafer Measurements
CHR2291
Bias Conditions : Vdm= Vdl= 3.5 V, Vgm= -0.7V, Vgb= -0.4V, Vgx= -0.6V, Vga= -0.4V
14 12 10 8 6 4 2
2LO Frequency
(dB)
0 -2 -4 -6 -8 -10 -12 -14 -16 11,0 12,0 13,0 14,0 15,0 16,0 17,0 18,0
RF Frequency (GHz)
Conversion gain & Image suppression with a 90 IQ combiner @ IF=1 & 1.5GHz
10 8 6 4 2 0 -2 -4 -6 -8 -10 -12 -14
-20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0
Freq. RF= 15GHz Freq LO= 7GHz
Conversion Gain_I (dB) IF_power_I (dBm) Conversion Gain_Q (dB) IF_power_Q (dBm)
Input RF power (dBm)
Input RF compression by channel
Ref. : DSCHR22912218 06-Aug.-02 3/6 Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
12-17GHz Integrated Down Converter
Typical On-board Measurements
CHR2291
Bias Conditions : Vdm= Vdl= 3.5 V, Vgm= -0.7V, Vgb= -0.4V, Vgx= -0.6V, Vga= -0.4V
32
LO= RF + IF
28 Rejection 24
(dB & dBc)
20 16 12 8 4 RF=12.75GHz 0 -2 -1,5 -1 -0,5 0 0,5 1 1,5 2 IF Frequency (GHz) Conversion Gain & Image Rejection with a 90 IQ combiner RF=14.05GHz RF=15.35GHz Gain
Ref. : DSCHR22912218 06-Aug.-02
4/6
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
12-17GHz Integrated Down Converter
Chip Assembly and Mechanical Data
CHR2291
LO IN
To Vgm DC Gate Supply To Vgb DC Gate Supply
Q OUT
To Vdm,Vdl DC Drain Supply
I OUT
To Vgx DC Gate Supply To Vga DC Gate Supply RF IN
Note : Supply feed should be capacitively bypassed. 25m diameter gold wire is recommended
Bonding pad positions
( Chip thickness : 100m. All dimensions are in micrometers )
Ref. : DSCHR22912218 06-Aug.-02 5/6 Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
12-17GHz Integrated down converter
CHR2291
Ordering Information
Chip form : CHR2291-99F/00
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.
Ref. : DSCHR22912218 06-Aug.-02
6/6
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09


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